BOARDS / DISPLAYS / PRECISION JOINTS

Electronics

Organize bonding, sealing, thermal transfer and board protection around process and reliability needs.

BONDING & PROTECTION

Start with the component.

Application illustration of fiber and optical-component fixation with electronic boards

AI & optical modules

Optical fixation & protection

Explore locations & review

Application illustration of an automotive camera and an open controller assembly

Automotive sensing

Cameras, sensors & controllers

Explore locations & review

Application illustration of structural joints, display frames and optical-component assembly

Displays & optics

Frames, supports & joints

Explore locations & review

EXPLORE THE COMPONENT

Explore where the material works.

Select a component to explore its requirements.

01Display modules and joints

CONDITIONS TO REVIEW

Substrates, joint area, gap and cure method

See the test methods ↓Explore the component challenge

02Boards and electronic parts

CONDITIONS TO REVIEW

Coverage, film thickness, masking and inspection

See the test methods ↓Explore the component challenge

03Precision dispensing process

CONDITIONS TO REVIEW

Dose, equipment, cure conditions and assembly cycle

See the test methods ↓Explore the component challenge

MATERIAL FAMILIES TO REVIEW

Electronic adhesives Conformal coatings PFPE & fluorinated greases Advanced materials & additives Fluorinated fluids

OPERATING CONDITIONS

Operating conditions & tests

Compare before and after material changes under matching conditions.

Repeatable dispensing

Match temperature, dose, needle and dispensing path.

Record: Applied width, dose, flow and assembly time

Cure and substrate effects

Match cure-process conditions to component limitations.

Record: Cure state, temperature history and joint appearance

Temperature & interfaces

Check joint strength and appearance after exposure on actual geometry.

Record: Before/after values, failure location and interface condition

APPLICATION TESTING

Component test sequence

Review the component
Set test criteria
Compare materials
Verify the assembly

TEST BRIEF

Information for your enquiry

Component and materials: Material grades, preparation, dimensions, contact surfaces and assembly conditions.
Environment and operation: Substrates and gap / Cure and dispensing conditions / Heat, moisture and insulation
Process and current material: Current grade, application/cure/cleaning conditions and when behaviour changed.
Acceptance and records: Targets, measurement methods, before/after photographs and values, and required life conditions.

DOCUMENTS & SAMPLES

Documents & evaluation samples

Request the information you need for product selection and internal evaluation.

Discuss these requirements

TDS

Technical properties & use guidance

Request SDS

Safe handling & storage

Request Evaluation sample

Try the material on your parts & process

Request

Material-selection questions

Are adhesives, potting materials and protective coatings interchangeable in electronics?

Selection depends on the required function in the actual assembly. Describe the joint, gap, protection area and process before comparing products. Substrates, curing, repair needs and test conditions must fit the application; a broad material-family label is not sufficient.